Beryllium copper shrapnel, as an excellent elastic material, is widely used in aerospace, military, electronics and other fields. The research of its Polishing technology is of great significance to improve the quality and performance of shrapnel. This paper mainly introduces the principle, method, Application and its research progress of beryllium copper shrapnel polishing technology.

First, beryllium copper shrapnel polishing role

Beryllium copper shrapnel is an alloy material composed of beryllium, copper and other elements, with high strength, high electrical conductivity, high thermal conductivity and good elasticity and other advantages. In many high-tech fields, such as aerospace, military, electronics, etc., the performance requirements of beryllium copper shrapnel are getting higher and higher, so the research on its polishing technology has become an important topic.

Second, beryllium copper shrapnel polishing technology principle

Beryllium copper shrapnel polishing technology is mainly the use of polishing agent on the surface of the shrapnel grinding, remove the surface of the microscopic unevenness and roughness, so as to obtain a smooth, flat surface. During the polishing process, the polishing agent rubs against the surface of the shrapnel, causing plastic deformation and microscopic cutting of the surface layer. The type, particle size, concentration of the polishing agent and the temperature and pressure of the polishing solution are important factors affecting the polishing effect.

Third, beryllium copper shrapnel polishing methods

1. Mechanical polishing: mechanical polishing is the most commonly used polishing methods, including manual polishing and mechanical polishing. Hand polishing is mainly carried out using polishing cloth and polishing paste, suitable for small area and complex shape of the shrapnel. Mechanical polishing is carried out using polishing machines and the corresponding polishing head, applicable to large areas and large quantities of shrapnel.

2. Chemical polishing: chemical polishing is the use of chemical reactions to remove the surface oxide layer and microscopic unevenness, so that the surface is smooth. The method has the advantages of fast polishing speed and good surface quality, but it is necessary to pay attention to the control of the concentration of polishing liquid and time to avoid over-throwing or under-throwing.

3. Electrochemical polishing: Electrochemical polishing is the use of electrolytic principle to remove surface microscopic unevenness and roughness. This method has the advantages of fast polishing speed, good surface quality, good controllability, etc., but the equipment cost is higher.

Fourth, the application of beryllium copper shrapnel polishing technology

1. Aerospace field: beryllium copper shrapnel has a wide range of applications in the aerospace field, such as aircraft engine components, aircraft structure parts. Through polishing technology, it can improve the fatigue life of shrapnel, electrical conductivity, thermal conductivity and other properties, thus improving the performance of aviation spacecraft.

2. Military field: in the military field, beryllium copper shrapnel is mainly used for shells, gun barrels and other components. Polishing technology can improve the sealing performance of shrapnel, reduce wear and tear, thereby improving the reliability of the weapon system.

3. Electronic field: beryllium copper shrapnel in electronic equipment is mainly used for heat sinks, electronic packaging and so on. Polishing technology can improve the heat dissipation performance of shrapnel, electroMagnetic properties, thereby improving the performance of electronic equipment.

V. Beryllium copper shrapnel polishing development

With the development of science and technology, the performance requirements of beryllium copper shrapnel are getting higher and higher, and the research of polishing technology has become an important topic. By continuously optimizing the polishing process and equipment, the quality and performance of shrapnel can be improved, so as to meet the high performance needs of various fields. In the future, beryllium copper shrapnel polishing technology will continue to develop in the direction of high efficiency, intelligence and green.